发明名称 APPARATUS FOR BONDING METAL PLATES
摘要 PURPOSE: A mold unit for a metal plate welding device is provided to weld two metal plates at low pressure by heating the metal plate below the melting point of each metal plate. CONSTITUTION: A mold unit for a metal plate welding device comprises a lower left mold(M1), a lower right mold(M2), an upper left mold(M3), and an upper right mold(M4). An overlapped part is welded by plastic flow because compression load is vertically applied on the mutual overlapped part of the metal plate. The upper and lower molds comprises a heating device(HT1,HT2) corresponding to the junction of each metal plate. The heating member heats the metal plate below the melting point.
申请公布号 KR20100079223(A) 申请公布日期 2010.07.08
申请号 KR20080137646 申请日期 2008.12.31
申请人 SUNG WOO HITECH CO., LTD. 发明人 LEE, MUN YONG;PARK, HYUN JUN
分类号 B21D39/03;B21D37/16;B23K20/02;B23K20/26 主分类号 B21D39/03
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