发明名称 CMP SLURRY COMPOSITION FOR POLISHING METAL WIRING AND POLISHING METHOD USING THE SAME
摘要 PURPOSE: A chemical mechanical polishing slurry composition is provided to have a high speed of polishing a metal wiring, to obtain a short polishing process time, and to be effectively used for the process of polishing the metal wiring by controlling the surface defects such as erosion. CONSTITUTION: A chemical mechanical polishing slurry composition for polishing a metal wiring ultrapure water, an abrasive, an oxidizing agent, a metallic complex compound, and a polymer. The polymer is an acrylic acid-acrylamide copolymer having a copolymerization ratio of 1:30-30:1, respectively. The average molecular weight of the acrylic acid-acrylamide copolymer is 600,000-1,300,000. The acrylic acid-acrylamide copolymer is used with an amount of 0.001-0.1 weight% based on the total slurry composition.
申请公布号 KR20100077360(A) 申请公布日期 2010.07.08
申请号 KR20080135278 申请日期 2008.12.29
申请人 CHEIL INDUSTRIES INC. 发明人 KIM, TAE WAN;KANG, DONG HUN;LIM, GEON JA;CHOI, WON YOUNG;LEE, IN KYUNG
分类号 C09K3/14 主分类号 C09K3/14
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