| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve light extraction efficiency of an LED light-emitting device, and to suppress deterioration of a package. <P>SOLUTION: A lead frame 13a is bent nearby an LED chip 10 to form a recessed portion 16 along long sides of the LED chip 10. A side surface 16b of the recessed portion 16 is gently inclined away from the LED chip 10 and toward a bottom surface of the recessed portion 11 of the package 12. The side surface 16b of the recessed portion 16 reflects emissive light from the LED chip 10 to improve the light extraction efficiency. Further, the recessed portion 16 is provided, so the quantity of light incident on a region, nearby the LED chip 10, on the side surface 11a of the recessed portion 11 of the package 12 decreases, thereby preventing the deterioration of the package 12. <P>COPYRIGHT: (C)2010,JPO&INPIT |
