RESIN COMPOSITION FOR SEALING ELECTRIC AND ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING ELECTRIC AND ELECTRONIC COMPONENT SEALED OBJECT, AND ELECTRIC AND ELECTRONIC COMPONENT SEALED OBJECT

摘要

PROBLEM TO BE SOLVED: To provide: an electric and electronic component sealed object excellent in durability under environmental loads such as a cold/hot cycle load, a high temperature/high humidity load and a high temperature load; a method for manufacturing an electric and electronic component sealed object suited to such applications; and a resin composition for sealing electric and electronic components for such applications. SOLUTION: The resin composition for sealing electric and electronic components is formulated with 0.1-50 pts.mass epoxy resin (B) and 0.5-50 pts.mass polyolefin resin (C) to 100 pts.mass crystalline polyester resin (A) and is characterized in that: the melt viscosity is 5-2,000 dPa s when the composition is dried to≤0.1% moisture content and heated to 220°C and extruded from a die with 1.0 mm hole diameter and 10 mm thickness under 1 MPa pressure; the retention of shear adhesion strength with a polybutylene terephthalate plate containing 30 wt.% glass filler is≥50% to the initial shear adhesion strength after application of 1,000 cold/hot cycles between 30 minutes at -40°C and 30 minutes at 80°C; and the retention of shear adhesion strength with a glass-epoxy plate is≥50% to the initial shear adhesion strength after application of 1,000 cold/hot cycles between 30 minutes at -40°C and 30 minutes at 80°C. COPYRIGHT: (C)2010,JPO&INPIT