| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for an electrical component simplifying the structure of a wiring film (an extended sheet), reducing the replacing frequency of the extended sheet and coping with a reduction in the pitch of electrical component terminals. SOLUTION: The socket includes the extended sheet 39 disposed on a wiring substrate 32 and a socket body 36 housing an IC package. The extended sheet 39 has a central contact part brought into contact with a solder ball of the IC packet on its upper surface central part side and an ambient contact part connected with the central contact part via wiring and is electrically connected with an electrode of the wiring substrate on its lower surface peripheral part side. A contact pin 43 is disposed on the socket body 36 and is provided with: an upper contact part brought into contact with the solder ball of the IC package on its upper end; and a lower contact part brought into contact with the central contact part of the extended sheet 39 on its lower end. COPYRIGHT: (C)2010,JPO&INPIT |
