| 摘要 |
PROBLEM TO BE SOLVED: To suppress conduction of heat of a power element to a control element while suppressing costs. SOLUTION: A resin sealed semiconductor apparatus 10 includes: a circuit board 12 mounted with the control element 18; a lead frame 14 having connection terminals 26 and 28 electrically connected to an external device and a body portion 30 having the circuit board 12 mounted on a surface and also mounted with the power element 32; and a mold resin 16 for sealing the circuit board 12 and body portion 30 in one body. A relief hole 46 is formed in the body portion 30 where it overlaps the control element 18 in plan view. In this configuration, even when heat is generated by the power element 32 and conducted to the body portion 30, the conduction of the heat, conducted to the body portion 30, to the control element 18 can be suppressed with the simple configuration in which the relief hole 46 is only formed. COPYRIGHT: (C)2010,JPO&INPIT |
