PLASTIC COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

The present invention relates to a plastic composition comprising (a) a halogen free epoxy resin having two or more epoxy groups; (b) a nitrile rubber; (c) an inorganic filler; and (d) a curing agent or a curing agent with a curing promoter. In addition, the present invention relates to a prepreg formed by coating or impregnating the plastic composition onto a glass substrate, and a printed circuit board including the prepreg or preferably a flexible printed circuit board.