发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 PURPOSE: An LED package is provided to diffuse light in all directions by arranging a light transmitting unit in a hole formed on a chip mounting unit. CONSTITUTION: A light transmitting unit(232) is arranged to fill a hole on a chip mounting unit. An LED chip(23) is mounted in the chip mount unit. An encapsulant covers the LED chip and the chip mounting unit. The chip mount unit is a lead frame or substrate. The light transmitting unit includes at least one fluorescent substance. The encapsulant includes at least one florescent substance.
申请公布号 KR20100079687(A) 申请公布日期 2010.07.08
申请号 KR20080138231 申请日期 2008.12.31
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 PARK, KWANG IL;SEO, TAE WON;LEE, SANG CHEOL;HWANG, WOONG JUN
分类号 H01L33/58 主分类号 H01L33/58
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