发明名称 STYRENIC RESIN COMPOSITION, POLYMERIZED PRODUCT AND MOLD OBTAINED FROM THE SAME
摘要 PURPOSE: A styrenic resin composition, and a polymerized product and a molded product obtained therefrom are provided to secure the shock resistance at a floor or a corner portion of the product after a vacuum molding process. CONSTITUTION: A styrenic resin composition contains 100 parts of monomer composition by weight, 0.001~1,500 ppm of initiator, 50~200 ppm of divinyl compound capable of polymerizing with a styrene compound, and 200~1,000 ppm of chain transfer agent. The monomer composition includes 88~96.5wt% of styrene compound, 3~10wt% of rubber compound, 0.5~2wt% of plasticizer, and 5~20wt% of organic solvent. A polymerized product obtained from the styrenic resin composition, contains a styrenic resin with the rubber average granularity over 7 microns, the tolerant product elongation over 60%, and the extensional viscosity over 1,000,000 pascal-second.
申请公布号 KR20100079682(A) 申请公布日期 2010.07.08
申请号 KR20080138224 申请日期 2008.12.31
申请人 HYUNDAI ENGINEERING PLASTICS CO., LTD. 发明人 PARK, KYUNG BAE;PARK, CHAN MOON;HWANG, SEUNG JUN
分类号 C08L25/04;C08F12/08;C08J5/00;C08L53/02 主分类号 C08L25/04
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