| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board suppressing transmission delay of a signal by constituting signal wiring having a low dielectric constant between a semiconductor chip and the outside when a capacitor etc., are incorporated in the wiring board. <P>SOLUTION: The wiring board 10 is mounted with the semiconductor chip 200 (mounted component), and includes: a core material 11 having a storage hole portion 11a formed penetrating the core material vertically; a capacitor 100 (built-in component) stored in the storage hole portion 11a and having a hollowed portion 100a formed therein; wiring laminate portions 12 and 13 each having an insulating layer and a conductor layer laminated alternately on the top and reverse sides of the core material 11; resin fillers 50 and 51 filled into a gap portion between the storage hole portion 11a and the capacitor 100 and into the hollowed portion 100a and having a lower dielectric constant than a material of the capacitor 100; and a through-hole conductor 60 penetrating the resin filler 51. The through-hole conductor 60 is used as signal wiring connected to the semiconductor chip 100 through the first wiring laminate portion 12, so that the transmission delay of the signal can be suppressed because of the low dielectric constant. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
