| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enhance output-side crosstalk and differential characteristics of a high frequency module. <P>SOLUTION: A high frequency module includes a switch substrate, an elastic wave filter substrate. On the switch substrate, in wiring for connecting a plurality of input terminals IN1-, IN1+, IN2-, IN2+ to output terminals OUT-, OUT+, partial wiring is formed. On the elastic wave filter substrate, the remaining wiring is formed including wiring crossing the wiring formed on the switch substrate in the wiring for connecting the plurality of input terminals IN1-, IN1+, IN2-, IN2+ to the output terminals OUT-, OUT+ and wiring for providing equal distances from the input terminals IN1-, IN1+, IN2-, IN2+ to the output terminals OUT-, OUT+. The high frequency module further includes bumps 70E-70J for electrically connecting the wiring on the switch substrate and the wiring on the elastic wave filter substrate at a fixed distance interval. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
