| 发明名称 |
SUBSTRATE TEMPERATURE CONTROL FIXING APPARATUS |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate temperature control fixing apparatus that reduces the generation of particles. <P>SOLUTION: The substrate temperature control fixing apparatus is provided with an electrostatic chuck adsorbing and holding an adsorbing target, on one face of a base and a base plate supporting the electrostatic chuck. A bank part is arranged at a periphery of one face of the base plate that faces the other face of the base. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
| 申请公布号 |
JP2010153490(A) |
申请公布日期 |
2010.07.08 |
| 申请号 |
JP20080328255 |
申请日期 |
2008.12.24 |
| 申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
SAITO MIKI;YOSHIKAWA TADAYOSHI;TAMAGAWA TERUKI |
| 分类号 |
H01L21/683;H02N13/00 |
主分类号 |
H01L21/683 |
| 代理机构 |
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