| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinder reducing frequency of dressing of a grinding wheel, causing no scratch on a wafer. SOLUTION: The grinder includes a chuck table retaining a workpiece and a grinding means rotatably supporting the grinding wheel that grinds the workpiece retained at the chuck table. The grinding wheel comprises an annular base having a mount attachment part attached to a wheel mount jointed to a tip end of a main spindle, and a plurality of the grinding wheel circularly disposed at a free end part of the annular base. A cleaning means cleaning an outer periphery side face and an inner periphery side face reaching from the mount attachment part to the free end part of the annular base is disposed in the grinder. COPYRIGHT: (C)2010,JPO&INPIT |
