发明名称 |
Stackable Semiconductor Device Packages |
摘要 |
In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.
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申请公布号 |
US2010171205(A1) |
申请公布日期 |
2010.07.08 |
申请号 |
US20090507305 |
申请日期 |
2009.07.22 |
申请人 |
CHEN KUANG-HSIUNG;SHEN CHI-CHIH;CHEN JEN-CHUAN;CHANG WEN-HSIUNG;CHANG HUI-SHAN;HSU PEI-YU;WU FA-HAO;CHIA CHEN-YU;CHU CHI-CHIH;WENG CHENG-YI;HSU YA-WEN |
发明人 |
CHEN KUANG-HSIUNG;SHEN CHI-CHIH;CHEN JEN-CHUAN;CHANG WEN-HSIUNG;CHANG HUI-SHAN;HSU PEI-YU;WU FA-HAO;CHIA CHEN-YU;CHU CHI-CHIH;WENG CHENG-YI;HSU YA-WEN |
分类号 |
H01L21/56;H01L23/00;H01L23/498 |
主分类号 |
H01L21/56 |
代理机构 |
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