发明名称 |
Technik zur Herstellung einer Passivierungsschicht ohne ein Abschlussmetall |
摘要 |
By determining at least one surface characteristic of a passivation layer stack used for forming a bump structure, the situation after the deposition and patterning of a terminal metal layer stack may be “simulated,” thereby providing the potential for using well-established bump manufacturing techniques while nevertheless significantly reducing process complexity by omitting the deposition and patterning of the terminal metal layer stack. |
申请公布号 |
DE102006051490(B4) |
申请公布日期 |
2010.07.08 |
申请号 |
DE20061051490 |
申请日期 |
2006.10.31 |
申请人 |
ADVANCED MICRO DEVICES INC. |
发明人 |
LETZ, TOBIAS;LEHR, MATTHIAS;HOHAGE, JOERG;KUECHENMEISTER, FRANK |
分类号 |
H01L21/283;H01L21/314;H01L21/60;H01L21/768 |
主分类号 |
H01L21/283 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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