PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition with improved adhesion property to a substrate without decreasing alkali developability.

SOLUTION: This photosensitive resin composition contains: a photosensitive resin with an acid value of 20-140 mgKHO/g having one or more radical polymerizable unsaturated bonds and one or more carboxyl groups in one molecule; a compound having one or more amide groups and one or more hydroxyl groups in one molecule; a photoinitiator; and a coloring agent.

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