| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having an interconnect structure with superior noise resistance such that loop inductance of an interconnect pair for supplying a power supply voltage is small and interference with other interconnect pairs is suppressed. SOLUTION: The wiring board includes a core layer 11 having conductor layers 21 and 23 formed on both surfaces, a core layer 12 having conductor layers 22 and 24 formed on both surfaces, an insulating layer 13 bonding the core layers 11 and 12 to each other, an insulating layer 14 laminated on the side of the core layer 11 and having a conductor layer 29 formed outside, and an insulating layer 15 laminated on the side of the core layer 12 and having a conductor layer 30 formed outside. The pair of conductor layers opposed to each other with the insulating layers 13, 14 and 15 interposed therebetween include a pair of interconnects comprising a power supply interconnect formed in one conductor layer and a ground interconnect formed in the other conductor layer, wherein the loop inductance thereof is reducible and mutual interference with other interconnect pairs can be suppressed. COPYRIGHT: (C)2010,JPO&INPIT |
