| 摘要 |
PURPOSE: A die pickup apparatus, a die pickup method, and a die attaching method are provided to prevent the delamination of a stack die by improving adhesion between a die and a substrate when the die is attached to the substrate. CONSTITUTION: A die pickup apparatus comprises a pickup unit(10) and a high frequency oscillator. The pickup unit picks up a die(30). The vacuum hole of the pickup unit generates the vacuum. The high frequency oscillator is adjacent to the pickup unit and generates an ultrasonic wave to the pickup unit. The amplitude of the ultrasonic wave generated by the high frequency oscillator is 15 um. |
