| 摘要 |
PURPOSE: A light emitting device package and a manufacturing method thereof are provided to improve the luminous efficiency of a light emitting device by improving a heat transmission path of the light emitting device. CONSTITUTION: A light emitting device package includes a package body(110), an insulation layer(120,121), a light emitting device(150), and first to third metal layers(140,141,145). The package body has a cavity. The insulation layer is formed on the surface of the package body. The first and second metal layers are formed on the insulation layer. The light emitting layer is formed on the bottom of the cavity and electrically connects the first and second electrode layers. The third metal layer is formed on the rear of the package body. |
