PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A printed circuit board and a semiconductor package for using the same are provided to directly install the semiconductor package on the module substrate by using the printed circuit board of the laminating structure having the cavity of the each other different size. CONSTITUTION: A first substrate(102a) comprises a first cavity(C1) and plurality of first lands(103). A second substrate(102b) comprises a second cavity(C2) and a plurality of secondary lands(105) exposing the first cavity. A via pattern(106) interlinks the first land and the secondary land through the inside of the second substrate. A bond finger(107) is arranged in the first cavity around. The second cavity comprises circular or the polygonal shape. The second cavity comprises the diameter bigger than the first cavity. The second cavity of the second substrate exposes the bond finger arranged in the first cavity around.