DIE ATTACH EQUIPMENT HAVING A STEP VACUUM ABSORPTION STRUCTURE AND DIE PICKUP METHOD THEREOF

摘要

PURPOSE: A die attach device by a sequential vacuum suction method and a pick-up method are provided to minimize damage to the die when picking up the attached die on an expanding tape in the die attach device. CONSTITUTION: A collet(200) is installed in A die attach machine inside a main body. The collet is used for picking up a die(300) from wafer to move it. A pickup stage(100) is located in a lower part of the collet. The sawed wafer is placed in the pickup stage. The pickup stage comprises a pickup stage main body and a plurality of vacuum pickup units(120). The vacuum pickup unit comprises a plurality of vacuum chuck holes(122).