| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board and method of manufacturing a semiconductor device, wherein tin-containing solder which is used for a gold-solder bonding system, is to be formed on a substrate interconnect, and contains tin is applied thick while suppressing film thickness variance. <P>SOLUTION: After a metal film 4 which can be replaced with tin-containing solder through metal substitution is provided among a plurality of connection portion conductor patterns provided on a mounting surface of the circuit board 1, the metal film is replaced with the tin-containing solder 5 through metal substitution, the replaced tin-containing solder is fused and divided between the connection portion conductor patterns, and the tin-containing solder 6 is applied thick onto connection portion conductor pattern surfaces. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
