| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for electronic component mounting, which can suppress inclination of an electrode on an upper surface at a circumference of a recessed portion. SOLUTION: The method of manufacturing the substrate for electronic component mounting includes a step of preparing first and second ceramic green sheets 1 and 2, a step of forming a through-hole at a center part being the recessed portion 7a and an electrode pattern 3 of conductor paste arrayed along the through-hole, a step of forming an auxiliary layer pattern 4 on an upper surface of the first ceramic green sheet 1 at a position where the auxiliary layer pattern overlaps an inner end of the electrode pattern 3 in plan view when the second ceramic green sheet 2 is stacked, a step of fabricating a laminate 7 by stacking the second ceramic green sheet 2 on the first ceramic green sheet 1 and by applying a pressure onto the stacked sheets, and a step of firing the laminate 7. The auxiliary layer pattern sheet 4 can suppress a state in which an upper surface of the electrode pattern 3 has a low inclined surface at an end side. COPYRIGHT: (C)2010,JPO&INPIT |
