| 摘要 |
PURPOSE: A semiconductor package and a plasma display device including the same are provided to directly connect a semiconductor chip and a reinforce plate by locating the semiconductor chip on the reinforce plate. CONSTITUTION: Signal is transmitted between a circuit board and a display panel through a film substrate(150). A semiconductor chip forms an electric contact-point with the film substrate. The film substrate and the semiconductor chip are directly attached to form a reinforcing plate which provides a floating ground. Connection units connect the reinforcing plate and the semiconductor chip, and the reinforcing plate and the film substrate. |
