LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: An LED package is provided to protect an LED chip, a bonding wire, and an encapsulant with a fluorescent cap by forming the encapsulant in a separate space between the LED chip and the fluorescent cap. CONSTITUTION: An LED chip(34) is located on a base(31). A fluorescent cap(36) is combined with the base, is separated from the LED chip, and covers the LED chip. An encapsulant is filled in a space between the LED chip and the fluorescent cap. A groove is formed on the base for combining with the fluorescent cap.