| 摘要 |
PURPOSE: A blade assembly of a wafer transfer device is provided to increase the lifetime of a ball bearing by changing the angle of a load applied in an axial direction and increasing the clamping force of the blade assembly. CONSTITUTION: One side of a first connector is fixed to a first arm of a wafer transfer robot. A ball bearing(140) is integrated with the first connector by a forced insertion operation. A pivot gear is formed on one side of the ring-shaped frame. A second connector is symmetrical with the first connector. One side of the second connector is fixed to a second arm of the wafer transfer robot. A ball bearing cover(130) is screwed to the upper side of a ball bearing through a fixed screw. A wave spring is formed between the inner ring of the ball bearing and the ball bearing cover.
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