发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PURPOSE: A polyamide resin composition is provided to secure the excellent heat deflection temperature, molding shrink rate, and intensity, and to prevent the color change of the composition. CONSTITUTION: A polyamide resin composition contains 100 parts of polyamide resin by weight, 7~23 parts of acrylonitrile/1,3-butadiene/styrene copolymer by weight, 14~25 parts of ethylene/ propylene copolymer by weight grafted with maleic anhydride, 0.5~2 parts of hydroxyphenyl benzotriazole by weight, and 1.5~2.5 parts of aluminum powder. The particle size of the aluminum powder is 30~60 microns.
申请公布号 KR20100079612(A) 申请公布日期 2010.07.08
申请号 KR20080138146 申请日期 2008.12.31
申请人 KTP INDUSTRIES, INC. 发明人 CHO, WON WOO;PARK, EUN HA;GOO, BON CHANG
分类号 C08L77/00;C08K3/10;C08L51/06;C08L55/02 主分类号 C08L77/00
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