LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: An LED package is provided to efficiency discharge heat generated from a light emitting chip by forming a plurality of heat sinks inside a housing. CONSTITUTION: An LED package includes a lead frame(200), a light emitting chip, a housing, and a plurality of heat sinks(500). The light emitting chip is electrically connected to the lead frame. The housing surrounds the part of the lead frame. The opening of the housing exposes the light emitting chip. A plurality of heat sink members is extended from the inside to the outside of the housing and discharges the heat generated from the light emitting chip to the outer side of the housing. The outer side of the housing faces the printed circuit board.