SEMICONDUCTOR DEVICE HAVING BONDING PAD AND METHOD OF FORMING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an integrated circuit with high reliability.

SOLUTION: An integrated circuit 20 includes a passivation layer 18 which covers a substrate 26 and a bonding pad 200 which covers the substrate 26. The bonding pad 200 includes a first wire bonding area 202 which is for connecting a first bonding wire to the integrated circuit 20 and a second wire bonding area 204 which is for connecting a second bonding wire to the integrated circuit. At least a non peripheral portion of the first wire bonding area 202 is located on the passivation and the passivation layer provided under the bonding pad 200 includes a plurality of openings. The substrate 26 includes a wiring area, at least a part of the wiring area is provided under a part of the bonding pad 200 located on the passivation, and the part of the wiring area is connected to the bonding pad 200 via the plurality of openings.

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