| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate connection structure in which when a hard substrate and a flexible substrate are thermocompression bonded, the height of soldering connection is regulated and positioning of connection can be made easily without using an exclusive jig. <P>SOLUTION: The substrate connection structure has a flexible substrate 6 on which a first connector 7 is formed, a hard substrate 4 on which a second connector 3 is formed, and a soldering connection part 5 where the first connector 7 and the second connector 3 are soldering connected. The flexible substrate 6 has a first insulation support member 8 arranged in a region adjacent to the soldering connection part 5. The hard substrate 4 has a second insulation support member 10 arranged in a region adjacent to the soldering connection part 5. The first connector 7 and the second connector 3 are soldering connected with the first insulation support member 8 and the second insulation support member 10 as references of positioning. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
