| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering apparatus reducing the number of motors for driving a fan. SOLUTION: A reflow soldering apparatus blows heated air from upper and lower parts of a substrate 7 by a heated air circulation apparatus 8 to solder electronic components on a substrate. The heated air circulation apparatus has: an upper circulation system having a fan 9A that sends heated air to an upper surface of the substrate, a heated air blowing means 12A that blows the heated air to the upper surface of the substrate, an inhalation duct 14 that is connected to an inhalation opening of the fan 9A and opens within a furnace 1 provided above a conveyer 5 and an exhaust duct 13A that connects the inhalation opening of the fan 9A with the heated air blowing means 12A; and a lower circulation system having a fan 9B that sends heated air to a lower surface of the substrate, a heated air blowing means 12B that blows the heated air to the lower surface of the substrate, and an exhaust duct 13B that connects an inhalation opening of the fan 9B with the heated air blowing means 12B. The fans 9A and 9B of the upper and lower circulation systems are driven by a common motor 10, and arranged in the furnace 1 provided below the conveyer 5. COPYRIGHT: (C)2010,JPO&INPIT |
