发明名称 CYLINDRICAL SPUTTERING TARGET
摘要 <P>PROBLEM TO BE SOLVED: To provide a cylindrical sputtering target whose using rate is improved, and which facilitates the injection of a solder material of In or the like, and can remarkably reduce the cleavages, cracks and peeling of solder or the like. Ž<P>SOLUTION: Regarding a plurality of cylindrical targets composed of a ceramic sintered compact such as ITO and AZO respectively, at least one of edge parts has a tapered shape and/or a stepped shape toward the inner circumference, a joining material (solder material) of In or the like is easily and smoothly injected into a gap between the cylindrical targets and a cylindrical base material, and they are joined so as to be a sputtering target. The obtained cylindrical sputtering target has high using efficiency, and has no cleavages, cracks and peeling. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010150610(A) 申请公布日期 2010.07.08
申请号 JP20080331175 申请日期 2008.12.25
申请人 TOSOH CORP 发明人 SATO MASARU;ITO KENICHI;SHIBUTAMI TETSUO
分类号 C23C14/34;C04B37/02;C23C6/00 主分类号 C23C14/34
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