| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit forming substrate on which sufficiently compact circuits can be formed with high density, and to provide an electronic device. Ž<P>SOLUTION: The circuit forming substrate 1 includes insulating substrates 2a-2c each having a penetration region 3, and through conductors 4 formed in the penetration regions 3 wherein the through conductor 4 is formed in taper shape so that one end face has the minimum diameter and the other end face has the maximum diameter, the through conductor 4 includes at least a first through conductor and a second through conductor which is arranged near the first through conductor in the same direction as the first through conductor, and the part B in the other end face of the first through conductor and the part B in the other end face of the second through conductor are arranged at different positions when viewed from the direction perpendicular to the thickness direction of the insulating substrates 2a-2c. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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