MAGNETIC FIELD CONTROL FOR UNIFORM FILM THICKNESS DISTRIBUTION IN SPUTTERING APPARATUS

摘要

A change of distribution due to progress of target erosion generated at the time of forming a film using a sputtering system is suppressed, and film thickness distribution and resistance value distribution are corrected to the optimum states.  The distance (MT distance) between the surface of a target and the surface of a magnet is corrected with the progress of the target erosion so as to keep constant the density of a magnetic flux formed on the surface of the target.  Furthermore, the distribution shape is made almost flat by setting two or more MT distances while a thin film is being formed by following a process recipe and the like and combining different distribution shapes.