| 摘要 |
<p>PURPOSE: A semiconductor light emitting device and a manufacturing method thereof are provided to prevent the bending of an LED chip from a shock which is applied to during a bonding process by arranging a plurality of camber protection members to be spaced apart in the region of a conductivity supporting member. CONSTITUTION: A light emitting structure laminates a compound semiconductor layer beneath an electrode layer(150). A plurality of pattern shaped camber protection members(160) are spaced apart on the electrode layer. A conductivity supporting member(170) is formed on the electrode layer and is arranged between the camber protection members. The camber protection member comprises at least one pattern among a plurality of pillar shaped patterns, a plurality of rod shaped patterns, and a pattern where a plurality of patterns are crossed each other at least one time.</p> |
