| 摘要 |
PURPOSE: A light source package is provided to prevent the oxidation of a lead frame surface by preventing the penetration of external air into the space between a chip molding part and a housing body part. CONSTITUTION: A driving power is applied to a lead frame(100) from the outside. A light emitting chip(300) is electrically connected to the lead frame. The light emitting chip generates light by receiving the driving power. A housing body part(210) comprises an opening which exposes a part of the lead frame and the light emitting chip. A chip molding part(400) seals hermetically a part of the lead frame and the light emitting chip. A top projection part(220) pressurizes the edge of the chip molding part.
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