Semiconductor pakage and the method for manufacturing thereof

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to realize high density mounting of chips by forming a QFN(Quad Flat No-lead) package like a package stack structure. CONSTITUTION: A QFN package includes the second semiconductor package and the first semiconductor package stacked on the second semiconductor package. The first and second terminal parts(102,202) of the QFN package are exposed through side portions to the outside. A plurality of first and second solder balls(114,214) are attached along the exposed side portions of the first and second terminal parts, respectively. The first and second semiconductor package are electrically connected with each other by bonding the corresponding first and second solder balls.