Circuit arrangement, especially frequency converter

摘要

A circuit-structured power metal layer (22) contacts a contact edge portion (26) provided on peripheral portion (28) of a circuit board (14). A circuit module (12) is bent at an angle of 90 degree with the circuit board. A power semiconductor chip (24) contacts the circuit-structured power metal layer of the circuit module. A substrate (30) is secured to a heat sink (16) in such a way that the heat is dissipated.