PHOTOSENSITIVE ADHESIVE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Disclosed is a method for manufacturing a semiconductor device. The method has a first step of arranging a photosensitive adhesive (insulating resin layer) on a substrate having a connecting terminal; a second step of patterning the photosensitive adhesive by exposure and development so as to form an opening from which the connecting terminal is to be exposed; a third step of forming a conductive layer by filling the opening with a conductive material; and a fourth step of directly bonding a semiconductor chip having a connecting electrode section to the photosensitive adhesive and electrically connecting the connecting terminal of the substrate and the connecting electrode section of the semiconductor chip to each other with the conductive layer in between.