| 摘要 |
<p>Provided are a semiconductor package and a plasma display device including the same. The semiconductor package includes: a film substrate that relays a signal between a circuit board and a display panel; a semiconductor chip that is electrically connected to the film substrate; a reinforcement plate to which the film substrate and the semiconductor chip are directly attached, and that provides a floating ground; and a connecting member that electrically connects the reinforcement plate and a ground of the semiconductor chip, and the reinforcement plate and a ground of the film substrate. Accordingly, the semiconductor package has excellent heat dissipation performance and ground stability.</p> |
