| 摘要 |
<p>An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment is disposed between the side wall and the manifold. The electronic equipment has a front, a rear, a top, a bottom and two sides. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment. An exhaust duct on the top of the enclosure is in fluid communication with the interior of the enclosure via an opening in the top of the enclosure. An adjustable filler panel assembly disposed above or below the electronic equipment prevents air from passing from side to side over or under the electronic equipment. A front filler panel disposed above or below the electronic equipment prevents air from passing from front to back over or under the electronic equipment.</p> |
