METHOD FOR MANUFACTURING TRAY BEING USED FOR HOLDING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A manufacturing method of a tray for loading a semiconductor package is provided to prevent the damage caused by the static electricity of a semiconductor package loaded on a tray by manufacturing a tray using the metal. CONSTITUTION: A die casting mold is prepared(210). The lubricating oil is inserted into the die casting mold(220). The metal dissolves in the high temperature and is inserted into the die casting mold(230). The metal inserted into the die casting mold is solidified(240). A tray is extracted from the die casting mold(250). The tray is anodized(260). The tray is coated(270).