发明名称 |
SUBSTRATE PROCESSING APPRTUS AND SYSTEM |
摘要 |
PURPOSE: A substrate processing apparatus and a substrate processing system using the same are provided to simplify the facility and manufacturing process by forming a plurality of thin film layers consecutively using single chamber. CONSTITUTION: First and second through holes are respectively formed on an upper surface and a bottom surface of a chamber(1100). A substrate settling unit(1200) is prepared in an internal space of the chamber. A substrate transfer unit(1300) transfers the substrate settling unit forth and back. A gas nozzle unit(1400) respectively sprays a first process gas and a second process gas to a substrate positioned on the substrate settling unit.
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申请公布号 |
KR20100076769(A) |
申请公布日期 |
2010.07.06 |
申请号 |
KR20080134932 |
申请日期 |
2008.12.26 |
申请人 |
AP SYSTEMS INC. |
发明人 |
JUNG, KI RO;YANG, SANG HEE;KANG, KI BOK;BAEK, SUNG HWAN |
分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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