发明名称 SUBSTRATE PROCESSING APPRTUS AND SYSTEM
摘要 PURPOSE: A substrate processing apparatus and a substrate processing system using the same are provided to simplify the facility and manufacturing process by forming a plurality of thin film layers consecutively using single chamber. CONSTITUTION: First and second through holes are respectively formed on an upper surface and a bottom surface of a chamber(1100). A substrate settling unit(1200) is prepared in an internal space of the chamber. A substrate transfer unit(1300) transfers the substrate settling unit forth and back. A gas nozzle unit(1400) respectively sprays a first process gas and a second process gas to a substrate positioned on the substrate settling unit.
申请公布号 KR20100076769(A) 申请公布日期 2010.07.06
申请号 KR20080134932 申请日期 2008.12.26
申请人 AP SYSTEMS INC. 发明人 JUNG, KI RO;YANG, SANG HEE;KANG, KI BOK;BAEK, SUNG HWAN
分类号 H01L21/20 主分类号 H01L21/20
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