发明名称 Method for forming an improved T-shaped gate structure
摘要 A T-shaped gate structure and method for forming the same the method including providing a semiconductor substrate comprising at least one overlying sacrificial layer; lithographically patterning a resist layer overlying the at least one sacrificial layer for etching an opening; forming the etched opening through a thickness of the at least one sacrificial layer to expose the semiconductor substrate, said etched opening comprising a tapered cross section having a wider upper portion compared to a bottom portion; and, backfilling the etched opening with a gate electrode material to form a gate structure.
申请公布号 US7749911(B2) 申请公布日期 2010.07.06
申请号 US20040001514 申请日期 2004.11.30
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 WU CHUNG-CHENG;CHU WEN-TING
分类号 H01L21/311 主分类号 H01L21/311
代理机构 代理人
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