WIRE STRUCTURE OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: A semiconductor wiring and forming method is provided to skip the selective etching process of a bit line by patterning using a trench and a contact hole to form a bit line and a bit line contact. CONSTITUTION: An element isolation region(105) setting an active area(101) on a semiconductor substrate(100) is formed. A first insulation layer(130), an etching stopping layer(140), and a stack of the second insulation layer are formed. A contact hole passing through the stack is formed.