| 摘要 |
This invention discloses a integrated circuit (IC) chip having a plurality of modular cells, the chip comprises a first modular cell having a first metal layer, which contains at least two power lines independent of each other; and a second modular cell, juxtaposed to the first modular cell, also having the first metal layer, which contains at least two power lines independent of each other, wherein all the power lines on the first metal layer serving the first modular cell do not extend into the second modular cell, and all the power lines on the first metal layer serving the second modular cell do not extend into the first modular cell.
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