发明名称 |
Circuit board for direct flip chip attachment |
摘要 |
A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.
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申请公布号 |
US7749813(B2) |
申请公布日期 |
2010.07.06 |
申请号 |
US20080038200 |
申请日期 |
2008.02.27 |
申请人 |
LUMINATION LLC |
发明人 |
KOLODIN BORIS;REGINELLI JAMES |
分类号 |
H01L21/00;H01L23/053;H01L23/12;H01L33/62;H05K1/00;H05K3/02;H05K3/10 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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