发明名称 |
Method of forming a circuit board |
摘要 |
A method of forming a circuit board, the method comprising mounting at least one passive component on a first surface of a first laminate material; interconnecting the passive component to contact traces and vias of the first laminate material; and attaching a second laminate material to the first surface of the first laminate material utilizing a lamination process, the second laminate material sheet having at least one of a recess, a through-hole or both formed therein for accommodating the passive component in the second laminate.
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申请公布号 |
US7748115(B2) |
申请公布日期 |
2010.07.06 |
申请号 |
US20070777988 |
申请日期 |
2007.07.13 |
申请人 |
THE AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH |
发明人 |
VASUDIVAN SUNAPPAN;LU CHEE WAI;LOK BOON KENG |
分类号 |
H01K3/10;H05K7/00 |
主分类号 |
H01K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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