发明名称 |
PHASE CHANGE RANDOMM ACCESS MEMORY DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>PURPOSE: A phase change memory device and a manufacturing method thereof are provided to reduce void between phase change pattern layers by forming a capping layer in the state a dielectric layer has been filled between the phase change pattern layers. CONSTITUTION: A plurality of phase change pattern layers(165) are formed on a semiconductor substrate(100). A first interlayer dielectric layer(110) is filled between the phase change pattern layers. A capping layer(190) is formed on the phase change pattern layers and the first interlayer dielectric layer. The phase change pattern layers are formed in a row in a memory cell line. A upper electrode(210) connected to the phase change pattern layers is further comprised.</p> |
申请公布号 |
KR20100076631(A) |
申请公布日期 |
2010.07.06 |
申请号 |
KR20080134745 |
申请日期 |
2008.12.26 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
KUM, KYONG SOO;KWON, KI SUNG |
分类号 |
H01L27/115;H01L21/8247 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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