IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: An image sensor and a manufacturing method thereof are provided to simplify processes and to reduce manufacturing cost by eliminating the need to use a photo injection process on a semiconductor substrate to define a pad hole. CONSTITUTION: A semiconductor substrate(100) comprises a first conductive substrate and a second conductive substrate(6) which are successively layered. A pad area is formed on the semiconductor substrate. The pad area makes contact with the first substrate via any area of the second substrate and the concentration of the impure ions in the pad area is higher than that of those in the second substrate. An insulating film is formed on the semiconductor substrate to cover the pad area. A pad hole(119) is formed on the second substrate and the insulating film to be aligned with the pad area of the second substrate.